Description:
- High precision with a small laser spot size of only 0.06 mm.
- Cutting depth in one pass – up to 12 mm.
- Large working area – 400 × 415 mm.
- Fast focusing.
- Built-in level.
- Convenient modular design.
- High safety characteristics according to FDA standards.
Specification:
- Machine Type: Semiconductor Laser Machine.
- Engraving Area (mm): 400 × 415.
- Laser Type: Semiconductor Laser.
- Laser Output Power (W): 10.
- Laser Wavelength (nm): 455 ± 5.
- Laser Spot Size (mm): 0.06.
- Engraving Depth (mm): 0 – 10.
- Cutting Thickness (mm): 0 – 18.
- Engraving Accuracy (dpi): 254.
- Engraving Speed (mm/min): max. 10 000.
- Safety Class: FDA Class I.
- Air Filter: Yes.
- Supported File Types: JPEG, JPG, PNG, BMP, SVG, DXF, GCODE.
- Operating System: Windows / MacOS.
- Supported Materials: Cardboard, wood, bamboo, clappers, rubber, leather, fabric, acrylic, plastic, metal.
- Software: Laser GRBL, Light Burn.
- Connectivity: TF Card, Type-C.
- Power Requirements: Input: 100~220V 50~60Hz, Output: DC 24V 3A.
